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1. | Executive Summary and Conclusions |
1.1. | Purpose of this report |
1.2. | What is 6G? |
1.3. | Communication evolution to 6G |
1.4. | Desired 6G capabilities: frequency, data rate, latency, ubiquity |
1.5. | Systems to keep up with rapidly advancing capabilities requested 1980-2045 |
1.6. | Trends in 5G networks continuing into 6G |
1.7. | 6G system elements from space to user |
1.8. | Choices for 6G RIS metasurface functionality |
1.9. | 5G base station technology inadequate for needs in 2030. THz and RIS extension of reach essential |
1.10. | Trend to beam forming and steering |
1.11. | Reconfigurable Intelligent Surface RIS design and materials |
1.12. | 6G RIS SOFT report |
1.13. | Primary conclusions |
1.14. | 6G and RIS roadmap 2021-2041 |
1.15. | Market forecasts |
1.15.1. | 6G RIS number, area, price, market value 2030-2041 |
1.15.2. | Potentially lowest unit cost for RIS basic structure |
1.15.3. | 6G Reconfigurable Intelligent Surface potential as base stations |
1.15.4. | 6G smartphones 2030-2041 |
1.15.5. | Low power WAN connections 2020-2030 |
1.15.6. | Low power WAN connections by application 2020-2030 |
1.16. | Patent analysis |
2. | Introduction |
2.1. | 6G in everyday language |
2.2. | The Terahertz Gap: Better devices essential |
2.3. | 6G origins and progress |
2.4. | Evolution 4G to 6G |
2.5. | Appalling attenuation means short range on land |
2.6. | Competition landscape for key 5G infrastructure vendors also tackling 6G |
2.7. | A closer look at issues |
2.8. | Promising Superman by using a mouse |
2.9. | It will be possible with RIS |
2.10. | How RIS will overcome 5G limitations |
2.11. | RIS applications in 6G |
2.12. | RIS materials toolkit |
2.13. | The big picture of 6G |
2.13.1. | Five enablers |
2.13.2. | AI- and ML-based approaches for the 6G localization and sensing solutions |
2.13.3. | Escalating economic and technology impact of 6G |
2.13.4. | Some challenges that are opportunities |
2.14. | 6G including RIS will leverage other terahertz electronics |
2.15. | RIS and the network and ICT energy challenge |
3. | Metamaterials and metasurfaces |
3.1. | Overview |
3.2. | Metasurfaces are now the focus |
3.3. | Passive not tunable or active tunable? |
3.4. | Design of passive and active RIS metasurface architectures |
3.5. | Basics: 6G metasurface design and mass production |
3.6. | 6G re-programmable metamaterials |
3.7. | Electrically tunable metasurfaces |
3.8. | Photonic metasurfaces |
3.9. | Graphene option |
3.10. | 3-5 compounds and SiGe options |
3.11. | Multilayer metasurfaces for RIS |
3.12. | ENZ metamaterials and metasurfaces |
3.13. | Metasurfaces for 6G base stations |
3.14. | Roundup including other views |
4. | 6G Reconfigurable Intelligent Surfaces RIS |
4.1. | Terminology nightmare |
4.2. | Overview |
4.3. | Applications envisaged |
4.4. | Choices for 6G RIS metasurface functionality |
4.5. | Semi-passive vs active functionality |
4.6. | Semi-passive RIS uniqueness |
4.7. | Sensing and imaging at higher frequencies and more locations |
4.8. | What is made possible |
4.9. | Outdoor RIS for 6G |
4.9.1. | Needs, WIET and other benefits |
4.9.2. | Locations in smart cities |
4.9.3. | Smart city companies as RIS integration partners |
4.9.4. | RIS for fine mapping |
4.9.5. | RIS technology enhancing base stations |
4.9.6. | Fully active RIS as a pseudo base station |
4.10. | Indoor RIS: Terminology and functionality |
4.11. | RIS challenges ahead and design choices |
4.11.1. | Overview |
4.11.2. | Achieving the functions |
4.11.3. | Tunability design issues |
4.11.4. | RIS configuration challenges |
4.12. | Relevant antenna design |
4.12.1. | Overview |
4.12.2. | Passive Electronically Steered Array PESA |
4.12.3. | New THz antennas for 6G |
4.12.4. | Plasmonic antenna improvements |
4.12.5. | InSb silica hyperbolic metamaterial antenna |
4.12.6. | Graphene THz antennas and plasmonics |
4.13. | Terahertz emitters and detectors |
4.14. | Terahertz transistors and diodes |
4.14.1. | Overview |
4.14.2. | InP and GaAs transistors |
4.14.3. | Schottky diode SiC graphene |
4.15. | Terahertz transceivers |
5. | Ultra fine line metal patterning needed |
5.1. | Conductive patterning needs for 6G RIS |
5.2. | Metasurface patterning needs |
5.3. | Terahertz metamaterials patterning |
5.4. | Photopatterning/ photolithography for fine metal line patterning |
5.4.1. | Photolithography followed by etching |
5.4.2. | Fujifilm's photo-patterned metal mesh TCF |
5.4.3. | Toppan Printing's copper metal mesh |
5.4.4. | Toppan Printing's copper metal mesh |
5.4.5. | Dai Nippon Printing's fine metal patterning |
5.4.6. | Tanaka Metal's metal mesh technology |
5.4.7. | Metamaterial Technologies novel photo patterning technique |
5.4.8. | Other Players: Panasonic, Foxconn |
5.4.9. | SWOT analysis on photo patterned fine metal line patterning |
5.5. | Embossing/imprinting to create ultra fine metal lines |
5.5.1. | Nanoimprinting 5um metal line width |
5.5.2. | O-Film's ultra fine line embossing technology |
5.5.3. | Some embossing approaches have not been commercially successful |
5.5.4. | SWOT analysis on embossed fine metal patterning |
5.6. | Directly printed fine metal lines |
5.6.1. | Gravure offset printed fine metal line (<5um) |
5.6.2. | Gravure offset printed fine metal lines: players |
5.6.3. | Print and plate for ultra fine metal lines |
5.6.4. | Asahi Kasei: Ultrafine metal line roll to roll printing process |
5.7. | Screen printing and Inkjet printing |
5.7.1. | Toray photocurable screen printed paste for fine line metal patterning |
5.7.2. | LCY and Screen Holding photoresist printing |
5.7.3. | XTPL sub 10um printed metal lines |
5.8. | Electrohydrodynamic printing enables high resolution: Enjet, Scrona, SIJ |
5.9. | Readiness level: Digital/high resolution printing |
5.10. | Direct metal plating on flexible glass |
6. | Dielectrics and polymers needed |
6.1. | Relevant challenges or high frequency 5G and for 6G |
6.2. | Opportunities for low loss materials in mmWave 5G and THz 6G |
6.3. | PTFE and LTCC |
6.4. | Liquid crystal polymers for 6G RIS |
6.5. | Fluoropolymers for THz frequencies |
6.6. | Dielectric constant: benchmarking different substrate technologies |
6.7. | Loss tangent: benchmarking different substrate technologies |
6.8. | Moisture uptake: benchmarking different substrate technologies |
6.9. | Radio frequency front end module (RF FEM) |
6.10. | Lessons from filter technologies at mmWave 5G |
6.11. | Optical devices key player and their market share |
Slides | 211 |
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Forecasts to | 2041 |
ISBN | 9781913899370 |