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1. | INTRODUCTION TO KEY TRENDS IN POWER ELECTRONICS AND THEIR LINK TO DIE ATTACH TECHNOLOGY |
1.1. | Power electronics in electric vehicles |
1.2. | General shift in power switch technology |
1.3. | Power switch technology: a generational shift towards SiC and GaN |
1.4. | Benchmarking Si vs SiC vs GaN |
1.5. | SiC and GaN still have substantial room to improve |
1.6. | Where will GaN and SiC win? |
1.7. | New technologies offer lower loss and higher frequency operation |
1.8. | Impact of high frequency on size of passive components |
1.9. | The driving challenge for SiC and GaN: not a drop-in replacement |
1.10. | The commercial justification for SiC in EV applications (I) |
1.11. | The commercial justification for SiC in EV applications (II) |
1.12. | Value chain for SiC power modules |
1.13. | Towards higher area power density and higher operating temperatures |
1.14. | Mega trend in power modules: increasing power density |
1.15. | Operation temperature increasing |
1.16. | Roadmap towards lower thermal resistance |
1.17. | Mega trend in power modules: increasing integration |
1.18. | Towards high-power IPM (intelligent power module) |
1.19. | Towards highly-integrated single-package solution at low power range |
1.20. | Traditional packaging technology |
1.21. | Non-thermal consideration in packages |
2. | HOW INTERCONNECT TECHNOLOGY IN POWER ELECTRONIC PACKAGING IS EVOLVING |
2.1. | Traditional packaging technology |
2.2. | Technology evolution beyond Al wire bonding |
2.3. | Al wire bond is a common source of failure |
2.4. | Al wire bonding remains strong in IGBT modules |
2.5. | Al wire bonding also used in SiC modules |
2.6. | Transition towards direct Cu lead bonding |
2.7. | Transition towards Cu pin bonding |
2.8. | Transition towards Cu wire bonding using Ag sintered buffer plates |
2.9. | Transition towards wireless flex film attached with Ag sintering |
2.10. | Transition towards metallized flex film attachment |
2.11. | Transition towards PVD metallization and photopatterning |
2.12. | Transition towards lead attach via soldered spacers |
2.13. | Transition towards lead attach via soldered spacers |
2.14. | Transition towards direct Cu wire bonding on Cu metallized die pads |
2.15. | Toyota SiC |
3. | TECHNOLOGY EVOLUTION FOR THE DIE AND SUBSTRATE ATTACH PASTE |
3.1. | Die attach technology trend |
3.2. | Die and substrate attach are common failure modes in power devices |
3.3. | The limitations of solder die attach joints |
3.4. | The choice of solder technology |
3.5. | Why metal sintering? |
3.6. | Patent trends for metal sintering |
3.7. | Sintering can be used at multiple levels (die-to-substrate, substrate-baseplate or heat sink, die pad to interconnect, etc) |
3.8. | Transition towards Ag sintering (Tesla 3 with ST SiC modules) |
3.9. | Transition towards Ag sintering (Tesla 3 with ST SiC modules) |
3.10. | Transition towards Ag sintering (Semikron) |
3.11. | Transition towards Ag sintering (Infineon) |
3.12. | Transition towards Ag sintering (ABB) |
3.13. | Transition towards Ag sintering (Continental) |
3.14. | Transition towards Ag sintering (Siemens) |
3.15. | Transition towards Ag sintering (Danfoss) |
3.16. | Transition towards Ag sintering (StartPower, MiroSemi) |
3.17. | Transition towards Ag sintering (Fuji Electric, CRRC/Dynex) |
3.18. | Transition towards Cu sintering (Hitachi) |
3.19. | Innovations to extend the lifetime |
4. | REVIEW OF CURRENT POWER MODULES IN ELECTRIC VEHICLES (HEV, PHEV, BEV) |
4.1. | Toyota Prius (2004-2010): power module |
4.2. | 2008 Lexus power module |
4.3. | Toyota Prius (2010-2015): power module |
4.4. | Toyota Prius (2016 onwards): power module |
4.5. | Chevrolet 2016 Power module (by Delphi) |
4.6. | Chevrolet 2016 Power module (by Delphi) |
4.7. | Cadillac 2016 power module (by Hitachi) |
4.8. | Hitachi suppliers many other vehicle markers |
4.9. | Nissan Leaf power module (2012) |
4.10. | Honda Accord 2014 Power Module |
4.11. | Honda Fit (by Mitsubishi) |
4.12. | BWM i3 (by Infineon) |
4.13. | Infineon: evolution of HybridPack and beyond |
4.14. | Infineon's HybridPack is used by multiple producers (SAIC, Hyundai, etc) |
4.15. | Tesla Mode S (discreet IGBT) and Model 3 (SiC module) |
4.16. | Others |
5. | METAL SINTERING DIE ATTACH MATERIALS, PROCESSES, AND SUPPLIERS |
5.1. | Pressured Ag sintered pastes: key characteristics |
5.2. | Sintering and pick-and-place machines |
5.3. | ASM SilverSAM: integrating sintering machine |
5.4. | Process steps for applying Ag sintered paste |
5.5. | Using film or preform vs paste |
5.6. | Using IR oven to speed up the process |
5.7. | Effect of time, pressure, and temperature on joint strength |
5.8. | Pressure-less Ag sintered pastes: key characteristics |
5.9. | Effect of substrate metallization on sintered joint shear strength |
5.10. | Nano vs Micro Particles in Ag sintering pastes |
5.11. | Suppliers of Ag sintered paste |
5.12. | Alpha: commercializing Ag nano sintering die attach paste |
5.13. | Heraeus: sintered Ag die attach paste |
5.14. | Dowa: nano Ag sintered die attach paste |
5.15. | Namics: Low temperature die attach Ag conductive paste |
5.16. | Namics: a variety of Ag die attach paste |
5.17. | Kyocera: mixed nano/micro pressure-less sintering die attach paste |
5.18. | Mitsubishi Materials: low temperature die attach Ag conductive paste |
5.19. | Henkel: Ag sintering paste¶ |
5.20. | Toyo Chem: Sintered die attach paste |
5.21. | Bando Chemical: pressure-less nano Ag sintering paste |
5.22. | Amo Green: pressure-less nano Ag sintering paste |
5.23. | Other Ag nanoparticle sintered die attach paste suppliers (e.g., Bando and NBE Tech) |
5.24. | Nihon Hanada: Pressureless sintering |
5.25. | Heraeus and Nihon Handa cross license |
5.26. | Indium Corp: nano Ag pressureless sinter paste |
5.27. | Nihon Superior: nano silver for sintering |
5.28. | Hitachi: Cu sintering paste |
5.29. | Cu sintering: characteristics |
5.30. | Reliability of Cu sintered joints |
5.31. | Mitsui Mining: Nano copper pressured and pressure-less sintering under N2 environment |
5.32. | Mitsui Mining: Nano copper pressured and pressure-less sintering under N2 environment |
5.33. | Transient liquid phase sintering: mid-level performance alternative? |
5.34. | SMIC: incumbent solder supplier |
5.35. | Some price info on Ag sintering, solder and TLPB |
5.36. | Mitsui Mining: Nano copper pressure-less sintering under N2 environment |
6. | MARKET FORECASTS FOR DIE ATTACH MATERIALS IN ELECTRIC VEHICLE POWER MODULES |
6.1. | Power level (kW) of power modules in different EV sectors (DC/DC HV/LV, on-board charger, inverter, 3-phase rectifier, etc) |
6.2. | Number of power module functions in different EV sectors (DC/DC HV/LV, on-board charger, inverter, 3-phase rectifier, etc) |
6.3. | Number dies in power modules in different EV sectors (DC/DC HV/LV, on-board charger, inverter, 3-phase rectifier, etc) |
6.4. | Electric vehicle forecast (2018 to 2028) |
6.5. | Die area forecasts (2018 to 2028) per unit by power electric function and electric vehicle type |
6.6. | Total power electronic die area forecasts segmented by electric vehicle type (2018 to 2029) |
6.7. | Addressable market size (in tones) for die and substrate attach (2018 to 2029) |
6.8. | Market forecasts (in tones) for Ag sintering paste in electric vehicle power electronics as die and substrate attach |
6.9. | Market forecasts (in million dollars) for Ag sintering paste in electric vehicle power electronics as die and substrate attach |
6.10. | Market forecasts (in million dollars and tons) for Cu sintering paste in electric vehicle power electronics as die and substrate attach |
6.11. | The evolution of different die attach paste technology between Nano Ag sintering, non-nano Ag sintering, SAC and other solders, Cu sintering, and Transient liquid phase bonding between 2018 and 2029 |
6.12. | Die and substrate attach market forecast (2018 to 2030) in Tons and Value split by SAC and other solder, nano Ag sintering, non-Ag sintering, Cu sintering, and transient liquid phase bonding |
6.13. | Die attach market forecast (2018 to 2030) in Tons and Value split by SAC and other solder, nano Ag sintering, non-Ag sintering, Cu sintering, and transient liquid phase bonding |
6.14. | Substrate attach market forecast (2018 to 2030) in Tons and Value split by SAC and other solder, nano Ag sintering, non-Ag sintering, Cu sintering, and transient liquid phase bonding |
Slides | 137 |
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Forecasts to | 2030 |