OSD62x: Texas Instruments AM62x based System-in-Package

Ease, Speed, Performance, Size

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The new OSD62x System-in-Package (SiP) family of devices empowers designers utilizing the AM62x processors to get to their design to market faster and in a smaller form factor.  It  enables them to build the next generation of  building and industrial automation/control,  IoT Gateway, Artificial Intelligence (AI) at the edge, Human Machine Interface (HMI) and other low-power high performance applications by allowing the designer to focus on features that will differentiate their product instead of spending time getting the processor to function.

The OSD62x offers two package options to meet the needs of a wide variety of applications.  The Max Integration option integrates the AM62x processor, LPDDR4, Power Management, EEPROM, Oscillators, Passives, and Additional Optional Integrations into a single package.  The Size Optimized option integrates the AM62x Processor, LPDDR4, and passives into a package the size of a single DDR device.

The OSD62x devices are currently in development and will be sampling in Q2 2024.  If you would like more information on the OSD62x Family of devices click the button below and fill out the form.

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OSD62x Max Integration Features

The OSD62x Max Integration package option provides designers with the fastest time to market for their AM62x-based design.

  • Integrated into a single BGA Package:
  • TI AM62x Features:
    • Up to 4x Arm® Cortex®-A53 @1.4GHz
    • Arm® Cortex®-M4F
    • Display subsystem
      • Supports 2x 1920×1080 @ 60fps
      • OLDI/LVDS (4 lanes – 2x) and 24-bit RGB parallel interface
    • 3D Graphics Processing Unit
      • Supports up to 2048×1080 @60fps
      • OpenGL ES 3.1, Vulkan 1.2
    • Camera Serial interface (CSI-Rx) – 4 Lane with DPHY
      • MIPI CSI 1.3 Compliant + MIPI-DPHY 1.2
    • 10/100/1000 Ethernet Switch with support for Time Sensitive Networking (TSN)
    • 2x USB2.0 Ports
    • 9x UART, 5x SPI, 6x I2C, 3x McASP
    • 3x ePWM, 3x eQEP, 3x eCAP
    • 3x CAN-FD
    • 1x eMMC, 2x SDIO, 1x GPMC
  • Single Power In
    • Generates all required power rails and sequencing
  • 22mm x 22mm BGA w/ 1mm Ball pitch
  • Optional Integration:
    • 8 Channel ADC
    • Real-Time Clock (RTC)
    • FPGA/CPLD
    • WiFi/BLE

OSD62x Max Integration Block Diagram
OSD62x Max Integration Block Diagram

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OSD62x Processor Module

The OSD62x Size Optimized package provides designers the smallest possible foot print while removing the pain of the DDR interface.

  • Integrated into a single BGA Package:
  • TI AM62x Features:
    • Up to 4x Arm® Cortex®-A53 @1.4GHz
    • Arm® Cortex®-M4F
    • Display subsystem
      • Supports 2x 1920×1080 @ 60fps
      • OLDI/LVDS (4 lanes – 2x) and 24-bit RGB parallel interface
    • 3D Graphics Processing Unit
      • Supports up to 2048×1080 @60fps
      • OpenGL ES 3.1, Vulkan 1.2
    • Camera Serial interface (CSI-Rx) – 4 Lane with DPHY
      • MIPI CSI 1.3 Compliant + MIPI-DPHY 1.2
    • 10/100/1000 Ethernet Switch with support for Time Sensitive Networking (TSN)
    • 2x USB2.0 Ports
    • 9x UART, 5x SPI, 6x I2C, 3x McASP
    • 3x ePWM, 3x eQEP, 3x eCAP
    • 3x CAN-FD
    • 1x eMMC, 2x SDIO, 1x GPMC
  • 9mm x 14mm BGA w/ 0.5mm Ball pitch

Learn More About the OSD62x Family


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